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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12101958 B1

PDFFull Text
Date of Patent:
Sep. 24, 2024

Filed:

Mar. 17, 2021

Organic electronic device including encapsulation layer

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hyun Jee Yoo, Daejeon, KR;

Hyun Suk Kim, Daejeon, KR;

Jung Ok Moon, Daejeon, KR;

Se Woo Yang, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Bryan Cave Leighton Paisner LLP

Primary Examiner:

Scott R Walshon

Assistant Examiner:

Thomas A Mangohig

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); C08F 255/10 (2006.01); C08K 5/101 (2006.01); C09J 4/06 (2006.01); C09J 7/10 (2018.01); C09J 7/28 (2018.01); C09J 7/38 (2018.01); C09J 123/22 (2006.01); C09J 133/04 (2006.01); C09J 133/08 (2006.01); C09J 151/04 (2006.01); H01L 23/31 (2006.01); H10K 10/88 (2023.01); H10K 30/88 (2023.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 71/00 (2023.01); H10K 85/10 (2023.01); C08K 3/16 (2006.01); C08K 3/22 (2006.01); C08K 3/30 (2006.01); C08K 5/01 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
H10K 50/844 (2023.02); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 37/1207 (2013.01); C08F 255/10 (2013.01); C08K 5/101 (2013.01); C09J 4/06 (2013.01); C09J 7/10 (2018.01); C09J 7/28 (2018.01); C09J 7/38 (2018.01); C09J 7/381 (2018.01); C09J 123/22 (2013.01); C09J 133/04 (2013.01); C09J 133/08 (2013.01); C09J 151/04 (2013.01); H01L 23/3135 (2013.01); H10K 10/88 (2023.02); H10K 30/88 (2023.02); H10K 50/84 (2023.02); H10K 50/846 (2023.02); H10K 71/00 (2023.02); H10K 85/141 (2023.02); B32B 2307/302 (2013.01); B32B 2307/724 (2013.01); B32B 2457/206 (2013.01); C08K 3/16 (2013.01); C08K 3/22 (2013.01); C08K 2003/3045 (2013.01); C08K 5/01 (2013.01); C09J 2203/326 (2013.01); C09J 2301/1242 (2020.08); C09J 2301/208 (2020.08); C09J 2301/302 (2020.08); C09J 2301/312 (2020.08); C09J 2301/40 (2020.08); C09J 2400/10 (2013.01); C09J 2423/00 (2013.01); H01L 23/28 (2013.01);
Abstract

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa·s to 10Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

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