The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Nov. 27, 2020
Applicant:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Inventors:

Nobutake Tsuyuno, Tokyo, JP;

Akira Matsushita, Hitachinaka, JP;

Toru Kato, Hitachinaka, JP;

Assignee:

Hitachi Astemo, Ltd., Hitachinaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H05K 5/03 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 7/003 (2013.01); H05K 5/03 (2013.01); H05K 7/20927 (2013.01);
Abstract

The resin materialis arranged in a first regionsurrounded by the fin base, the inclined portionof the cover member, and the outermost peripheral heat dissipation finsarranged on the outermost peripheral side. Then, the resin materialis caused to protrude to the first region. That is, the resin materialis arranged in the first region. In a cross section perpendicular to the refrigerant flow direction (Y direction), a cross-sectional area of the first regionis larger than an average cross-sectional areaof the adjacent heat dissipation fins. Then, a cross-sectional area of a second regionformed between the resin materialarranged in the first regionand the outermost peripheral heat dissipation finarranged on the outermost peripheral side is smaller than the average cross-sectional areaof the heat dissipation fins.


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