The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Mar. 31, 2021
Koninklijke Philips N.v., Eindhoven, NL;
Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, The Hague, NL;
Marinus Arnoldus Martinus Vugts, Beetsterzwaag, NL;
Pascal Jean Henri Bloemen, Eindhoven, NL;
Aristeidis Katsiorchis, Eindhoven, NL;
Johannes Antonius Jansen, Utrecht, NL;
Donald Thackray, Zuidlaren, NL;
Christian Steven Van Eek, Leewarden, NL;
Ramachandra Rao Ganesh, Groningen, NL;
Stephan Harkema, Hilversum, NL;
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO, The Hague, NL;
Abstract
In an embodiment, a method of manufacturing () is described. The method comprises providing () a first layer defining a first inner surface () and a first outer surface (), a second layer defining a second inner surface () and a second outer surface (), and an electrical component () positioned on the first inner surface or the second inner surface. The method further comprises attaching () the first and second layers together to create a device () comprising the first and second layers, wherein the first outer surface and the second outer surface define an external surface of the device. The device further comprises a sealed portion () defined by liquid-tight attachment between the first and second inner surfaces. In use of the device, the sealed portion prevents liquid ingress into the device between the first and second layers towards the electrical component.