The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Mar. 07, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Hee-Joon Chun, Suwon-si, KR;
Jae Sung Sim, Suwon-si, KR;
Hak Young Lee, Suwon-si, KR;
Kwang Hee Kwon, Suwon-si, KR;
Hee Jung Jung, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).