The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Jul. 03, 2023
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 1/028 (2013.01); H05K 1/0393 (2013.01); H05K 1/181 (2013.01); H05K 3/28 (2013.01); H05K 3/3452 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 1/189 (2013.01); H05K 3/244 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10136 (2013.01);
Abstract
A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.