logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12101877 B1

PDFFull Text
Date of Patent:
Sep. 24, 2024

Filed:

Feb. 23, 2021

Circuit board assembly and semi-finished product thereof, floodlight, camera module and application thereof

Applicant:

Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;

Inventors:

Zhen Huang, Yuyao, CN;

Junjie Zeng, Yuyao, CN;

Chenxiang Xu, Yuyao, CN;

Feifan Chen, Yuyao, CN;

Assignee:

NINGBO SUNNY OPOTECH CO., LTD., Yuyao, CN;

Attorney:

HAUPTMAN HAM, LLP

Primary Examiner:

Kathleen M Walsh

Int. Cl.
CPC ...
G01S 17/894 (2020.01); G03B 30/00 (2021.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); G01S 17/894 (2020.01); G03B 30/00 (2021.01); H04N 23/56 (2023.01); H04N 23/57 (2023.01); H05K 1/0274 (2013.01); H05K 2201/10113 (2013.01); H05K 2201/10121 (2013.01);
Abstract

The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.

Find Patent Forward Citations

Huang, Zhen. (2024). Circuit board assembly and semi-finished product thereof, floodlight, camera module and application thereof (U.S. Patent No. 12101877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12101877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…