The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Aug. 26, 2022
Rohde & Schwarz Gmbh & Co. KG, Munich, DE;
Rohde & Schwarz GmbH & Co. KG, Munich, DE;
Abstract
A circuit module comprising a printed circuit board, PCB, arrangement, a connection module, CM, and a high frequency circuit carrier, HFCC, are provided. The HFCC is arranged on the PCB arrangement. The CM is mounted on the PCB arrangement. The CM comprises at least one connection pad and is configured to electrically connect a metallic structure on or in the printed circuit board to the connection pad of the CM. The HFCC comprises at least one connection pad. At least one bond wire is provided to electrically connect the at least one connection pad to the HFCC to the at least one connection pad of the CM. The CM has a height over the PCB so that the at least one connection pad of the HFCC and at least one connection pad of the CM are on a same level or have a height difference that is less than 2 mm, preferably less than 1 mm, most preferably less than 0.8 mm.