The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Oct. 07, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Eunseok Hong, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A rigid flexible printed circuit board (RFPCB) may include: a first base conductive layer; a first rigid conductive layer spaced apart from the first base conductive layer in a first direction; a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction intersecting the first direction; a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer; a transmission line positioned between the first base conductive layer and the base cover layer; and a dummy metal layer disposed on the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile