The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
May. 22, 2023
Applicant:
Avicenatech Corp., Sunnyvale, CA (US);
Inventors:
Robert Kalman, Sunnyvale, CA (US);
Bardia Pezeshki, Sunnyvale, CA (US);
Alexander Tselikov, Sunnyvale, CA (US);
Cameron Danesh, Sunnyvale, CA (US);
Assignee:
AvicenaTech Corp., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/42 (2006.01); H04B 10/25 (2013.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/4246 (2013.01); H04B 10/25 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 2201/10121 (2013.01);
Abstract
For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.
Kalman, Robert. (2024). Hybrid integration of microled interconnects with ics (U.S. Patent No. 12101122). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12101122
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile