The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Jul. 21, 2023
Applicant:

Sony Group Corporation, Tokyo, JP;

Inventors:

Atsushi Masagaki, Kanagawa, JP;

Yusuke Tanaka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G02B 7/34 (2021.01); H01L 21/76 (2006.01); H04N 25/62 (2023.01); H04N 25/76 (2023.01); H04N 25/778 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14621 (2013.01); G02B 7/34 (2013.01); H01L 21/76 (2013.01); H01L 27/14605 (2013.01); H01L 27/14607 (2013.01); H01L 27/14627 (2013.01); H01L 27/1463 (2013.01); H01L 27/14641 (2013.01); H01L 27/14612 (2013.01); H01L 27/1464 (2013.01); H04N 25/62 (2023.01); H04N 25/76 (2023.01); H04N 25/778 (2023.01);
Abstract

The present disclosure relates to a solid-state image pickup device and an electronic apparatus that are capable of preventing leakage of charges between adjacent pixels. A plurality of pixels perform photoelectric conversion on light incident from a back surface via different on-chip lenses for each pixel. A pixel separation wall is formed between pixels adjacent to each other, and includes a front-side trench formed from a front surface and a backside trench formed from the back surface. A wiring layer is provided on the front surface. The present disclosure is applicable to, for example, a backside illuminated CMOS image sensor.


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