The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Jan. 26, 2021
Applicant:
Huawei Technologies Co., Ltd., Guangdong, CN;
Inventors:
Assignee:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 23/10 (2006.01); H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); G02F 1/1368 (2006.01); H01L 25/16 (2023.01); H10K 59/12 (2023.01);
U.S. Cl.
CPC ...
H01L 27/1255 (2013.01); H01L 23/10 (2013.01); H01Q 21/00 (2013.01); G02F 1/1368 (2013.01); H01L 25/167 (2013.01); H10K 59/12 (2023.02);
Abstract
Example array substrates are provided. One example array substrate includes an underlying substrate, an antenna and a component layer, where the antenna and the component layer are located on a same side of the underlying substrate, where the component layer and the antenna are disposed at intervals, where the component layer includes a plurality of metal laminates and a plurality of dielectric laminates that are stacked, and where the plurality of metal laminates and the plurality of dielectric laminates are alternately disposed to form a plurality of thin film transistors.