The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Nov. 29, 2021
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Masahiko Suzuki, Sakai, JP;

Tetsuo Kikuchi, Sakai, JP;

Setsuji Nishimiya, Sakai, JP;

Kengo Hara, Sakai, JP;

Hitoshi Takahata, Sakai, JP;

Tohru Daitoh, Sakai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/66 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); H01L 27/1225 (2013.01); H01L 27/127 (2013.01); H01L 29/66742 (2013.01); H01L 29/7869 (2013.01); H01L 29/78696 (2013.01);
Abstract

An active matrix substrate includes a plurality of oxide semiconductor TFTs, and a plurality of wiring line connection sections, each of the plurality of wiring line connection sections includes a first connection electrode, an interlayer insulating layer extending over the first connection electrode, a wiring line contact hole formed in an insulating layer including the interlayer insulating layer, the wiring line contact hole exposing a part of a metal oxide layer of a first connection electrode, and a second connection electrode, and the second connection electrode is connected to a part of the metal oxide layer of the first connection electrode in the wiring line contact hole.


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