The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Jul. 21, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jay Scott Salmon, San Diego, CA (US);

Anirudh Bhat, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/14 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Multi-component modules (MCMs), including configurable electromagnetic interference (EMI) shield structures and related methods, are disclosed. An EMI shield enclosing an IC or another electrical component in an MCM can protect other components within the MCM from EMI generated by the enclosed component. The EMI shield also protects the enclosed component from the EMI generated by other electrical components. An EMI shield with sidewall structures, in which vertical conductors supported by a wall medium electrically couple a lid of the EMI shield to a ground layer in a substrate, provides configurable EMI protection in an MCM. The EMI shield may also be employed to increase heat dissipation. The sidewall structures of the EMI shield are disposed on one or more sides of an electrical component and are configurable to provide a desired level of EMI isolation.


Find Patent Forward Citations

Salmon, Jay. (2024). Multi-component modules (mcms) including configurable electromagnetic isolation (emi) shield structures and related methods (U.S. Patent No. 12100669). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12100669

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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