The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Feb. 25, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Disclosed is a semiconductor package comprising a lower substrate including a conductive line; a first semiconductor chip on the lower substrate; an under-fill layer between the first semiconductor chip and the lower substrate, the under-fill layer including a central part below the first semiconductor chip and an edge part isolated from direct contact with the central part in a first direction parallel to a top surface of the lower substrate, and a recess region between the central part and the edge part. The recess region may be defined by a sidewall of the central part, a sidewall of the edge part, and a top surface of the conductive line in the lower substrate.