The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Oct. 21, 2022
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventor:

Riki Suemasa, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/12 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/306 (2013.01);
Abstract

A ceramic electronic component includes a multilayer chip in which dielectric layers, which contain ceramic as a main component, and internal electrode layers, which contain a first metal as a main component, are alternately stacked, wherein one face of first and second faces opposite to each other in a stack direction of each of the internal electrode layers is covered with a metal oxide film of a second metal that is more easily oxidized than the first metal and the other face of the first and second faces is not covered with the metal oxide film, or the one face is covered with the metal oxide film and an area of the metal oxide film covering the other face is smaller than an area of the metal oxide film covering the one face.


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