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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12100530 B1

PDFFull Text
Date of Patent:
Sep. 24, 2024

Filed:

Nov. 28, 2019

Silver paste

Applicant:

Shoei Chemical Inc., Tokyo, JP;

Inventors:

Kousuke Nishimura, Tosu, JP;

Naoto Shindo, Tosu, JP;

Hiroshi Mashima, Tosu, JP;

Assignee:

SHOEI CHEMICAL INC., Tokyo, JP;

Attorney:

Alleman Hall & Tuttle LLP

Primary Examiner:

Haidung D Nguyen

Int. Cl.
CPC ...
H01B 1/22 (2006.01); B22F 1/00 (2022.01); B22F 1/06 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/103 (2022.01); C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 101/02 (2006.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B22F 1/00 (2013.01); B22F 1/06 (2022.01); B22F 1/10 (2022.01); B22F 1/102 (2022.01); B22F 1/103 (2022.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 7/69 (2018.01); C09D 7/70 (2018.01); C09D 101/02 (2013.01); B22F 1/052 (2022.01); B22F 1/065 (2022.01); B22F 2301/255 (2013.01); B22F 2304/10 (2013.01);
Abstract

The present invention provides a silver paste, containing at least a silver powder, a binder resin, and an organic solvent, in which a content of the silver powder based on the silver paste is 80.00 to 97.00% by mass, D10 is 1.00 to 3.00 μm and D50 is 3.00 to 7.00 μm, where D10 and D50 respectively represent a 10% value and a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement of the silver powder, the silver powder has a specific surface area of 0.10 to 0.30 m/g, the silver powder has a copper content of 10 to 5000 ppm by mass, a content of the binder resin based on the silver powder is 0.430 to 0.750% by mass, and the silver paste has a dry film density of 7.50 g/cmor more.

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