The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Jul. 31, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Christian Lavoie, Pleasantville, NY (US);

Benjamin Wymore, Cortlandt Manor, NY (US);

Markus Brink, White Plains, NY (US);

Sweet Jean L., Albany, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 5/04 (2023.01); G06N 10/00 (2022.01); H03K 17/92 (2006.01); H03K 19/195 (2006.01);
U.S. Cl.
CPC ...
G06N 10/00 (2019.01); H03K 17/92 (2013.01); H03K 19/195 (2013.01);
Abstract

A method of increasing grain size of polycrystalline superconducting materials for superconducting circuits, includes forming an initial superconducting epitaxial layer lattice matched to a substrate formed of a substrate material, the initial superconducting epitaxial layer formed of a compound including the substrate material and a first metal; and forming a second layer of the first metal on the initial superconducting epitaxial layer and heating the layers to increase a thickness of the initial superconducting epitaxial layer formed of the compound.


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