The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Oct. 26, 2021
Applicant:

Exo Imaging, Inc., Redwood City, CA (US);

Inventors:

Liang Wang, Newark, CA (US);

Yusuf Haque, Woodside, CA (US);

Janusz Bryzek, Oakland, CA (US);

Assignee:

Exo Imaging, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/00 (2006.01); B81B 7/00 (2006.01); G01S 7/52 (2006.01); G01S 15/89 (2006.01);
U.S. Cl.
CPC ...
G01S 7/52079 (2013.01); B81B 7/008 (2013.01); G01S 7/5205 (2013.01); G01S 15/8925 (2013.01); B81B 2201/0271 (2013.01);
Abstract

An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.


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