The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Jun. 01, 2022
Applicant:

Baker Hughes Holdings Llc, Houston, TX (US);

Inventors:

Wanjun Cao, The Woodlands, TX (US);

Marc Bird, Houston, TX (US);

Assignee:

Baker Hughes Holdings LLC, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/573 (2006.01); B24D 18/00 (2006.01); C04B 35/528 (2006.01); C04B 35/56 (2006.01); C04B 35/563 (2006.01); C04B 35/565 (2006.01); C22C 26/00 (2006.01); E21B 10/54 (2006.01); E21B 10/567 (2006.01);
U.S. Cl.
CPC ...
E21B 10/5735 (2013.01); B24D 18/0009 (2013.01); C04B 35/528 (2013.01); C04B 35/56 (2013.01); C04B 35/5607 (2013.01); C04B 35/5611 (2013.01); C04B 35/5615 (2013.01); C04B 35/5618 (2013.01); C04B 35/5622 (2013.01); C04B 35/563 (2013.01); C04B 35/565 (2013.01); C22C 26/00 (2013.01); E21B 10/5673 (2013.01); C22C 2026/006 (2013.01); E21B 10/54 (2013.01);
Abstract

A cutting element comprises a supporting substrate, and a cutting table attached to an end of the supporting substrate. The cutting table comprises inter-bonded diamond particles, and a thermally stable material within interstitial spaces between the inter-bonded diamond particles. The thermally stable material comprises a carbide precipitate having the general chemical formula, AXZ, where A comprises one or more of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Y, Zr, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ac, Th, Pa, and U; X comprises one or more of Al, Ga, Sn, Be, Bi, Te, Sb, Se, As, Ge, Si, B, and P; Z comprises C; and n is greater than or equal to 0 and less than or equal to 0.75. A method of forming a cutting element, an earth-boring tool, a supporting substrate, and a method of forming a supporting substrate are also described.


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