The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Aug. 30, 2021
Applicant:

Tekna Plasma Systems Inc., Sherbrooke, CA;

Inventors:

Jiayin Guo, Sherbrooke, CA;

Eric Bouchard, Montreal, CA;

Richard Dolbec, Varennes, CA;

Assignee:

Tekna Plasma Systems Inc., Sherbrooke, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/065 (2022.01); B22F 9/12 (2006.01); C22C 1/04 (2023.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
C22C 1/0433 (2013.01); B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/056 (2022.01); B22F 1/065 (2022.01); B22F 9/12 (2013.01); H01G 4/008 (2013.01); B22F 2304/05 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01);
Abstract

The present disclosure generally relates to metallic powders for use in multilayer ceramic capacitors, to multilayer ceramic capacitors containing same and to methods of manufacturing such powders and capacitors. The disclosure addresses the problem of having better controlled smaller particle size distribution, with minimal contaminant contents which can be implemented at an industrial scale.


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