The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Dec. 21, 2023
Sichuan University, Sichuan, CN;
Junwen Ren, Chengdu, CN;
Zi Wang, Chengdu, CN;
Shenli Jia, Chengdu, CN;
Lihua Zhao, Chengdu, CN;
Huachao Wei, Chengdu, CN;
Chao Bian, Chengdu, CN;
Guoqing Jiang, Chengdu, CN;
Ruichi Zeng, Chengdu, CN;
SICHUAN UNIVERSITY, Chengdu, CN;
Abstract
A composite insulating material based on dielectrophoretic force orientation and its preparation method are provided. The method includes: S, preparing dielectric composite microspheres with a dielectric epoxy resin as a core and a hexagonal boron nitride sheet as a shell; S, dispersing the hexagonal boron nitride sheet and the dielectric composite microspheres in an organic solvent to obtain a dispersion liquid, and adding an epoxy resin, an epoxy resin curing agent, and an epoxy resin accelerator to the dispersing liquid, and evaporating the organic solvent to obtain a composite substrate; S, pouring the composite substrate into a container, wherein an upper surface and a lower surface of the container are connected with electrodes, respectively, transferring the container to a vacuum oven, and connecting a power supply of the container to adjust a voltage amplitude and a frequency of the electrodes, conducting dielectrophoretic force orientation on the dielectric composite microspheres in the composite substrate, so as to cause the dielectric composite microspheres to arrange along a direction of electric field; S, increasing a temperature of the container to cure the composite substrate, cutting off the power supply to the container after curing, and obtaining the composite insulating material.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile