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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12098257 B1

PDFFull Text
Date of Patent:
Sep. 24, 2024

Filed:

Jul. 16, 2020

Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hirosuke Saito, Osaka, JP;

Yiqun Wang, Osaka, JP;

Hiroharu Inoue, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

John Vincent Lawler

Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 15/092 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); C08L 63/08 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C08J 5/249 (2021.05); B32B 5/02 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); C08J 5/24 (2013.01); C08L 63/08 (2013.01); H05K 1/0353 (2013.01); H05K 1/036 (2013.01); H05K 3/022 (2013.01); B32B 2260/046 (2013.01); B32B 2307/206 (2013.01); B32B 2457/04 (2013.01); B32B 2457/08 (2013.01); C08J 2363/08 (2013.01); C08J 2453/00 (2013.01); C08J 2471/12 (2013.01); C08L 2205/03 (2013.01);
Abstract

An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent. In Formula (1), p represents 0 to 10, Z represents an arylene group, and Rto Reach independently represent a hydrogen atom or an alkyl group. In Formula (2), Rrepresents a hydrogen atom or an alkyl group.

Find Patent Forward Citations

Saito, Hirosuke. (2024). Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board (U.S. Patent No. 12098257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12098257

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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