The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Dec. 11, 2019
Applicant:
Meere Company Inc., Hwaseong-si, KR;
Inventors:
Assignee:
Meere Company Inc., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 33/033 (2006.01); B23K 26/53 (2014.01); B26D 7/08 (2006.01); C03B 33/08 (2006.01); C03B 33/09 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/033 (2013.01); B23K 26/53 (2015.10); B26D 7/086 (2013.01); C03B 33/082 (2013.01); C03B 33/091 (2013.01); B23K 2103/54 (2018.08);
Abstract
This application relates to a method and system for cutting a brittle body. In one aspect, the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.
Lee, Joon. (2024). Method and device for cutting structure composed of brittle material (U.S. Patent No. 12098087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12098087
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile