The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Dec. 23, 2020
Applicant:

Oceaneering International, Inc., Houston, TX (US);

Inventors:

Marc Christensen, Friendswood, TX (US);

Peter Carow, Pearland, TX (US);

Eric Curley, League City, TX (US);

Andrew Curtis, Seabrook, TX (US);

James Stein, Houston, TX (US);

Lee Vyoral, League City, TX (US);

Michael M Withey, Seabrook, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B29C 65/52 (2006.01); F16B 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/4855 (2013.01); B29C 65/4815 (2013.01); B29C 65/525 (2013.01); F16B 11/006 (2013.01);
Abstract

In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.


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