The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2024
Filed:
Nov. 08, 2018
Sensima Inspection Sàrl, Gland, CH;
Marc Lany, Rolle, CH;
Frédéric Monnier, Cortaillod, CH;
Bernard Revaz, Geneva, CH;
Gilles Santi, Lausanne, CH;
Adrian Spierings, Wittenbach, CH;
Philipp Stoll, Horn, CH;
Alexandre Staub, St. Gallen, CH;
SENSIMA INSPECTION SÅRL, Gland, CH;
Abstract
The invention concerns a method for additive manufacturing a component by repetitively superposing and solidifying material layers according to a 3D model of the component. The method comprises the steps of scan, by means of an eddy current sensing unit (), of a new solidified cross section () obtained by selectively solidifying a material layer so as to provide an integrity data (VMM) of a sensed portion (). A difference between the sensed integrity data (VMM) and an expected integrity data (VEE) is then executed for detecting a manufacturing anomaly within this portion. The expected integrity data (VEE) is determined based on collected integrity data of a solid basic structure likely matching or being identical to a geometrical structure () obtained from the 3D model () of a portion corresponding to said sensed portion (), said solid basic structure being manufactured or simulated according to another 3D model.