The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Oct. 03, 2016
Applicant:

Nikon Corporation, Tokyo, JP;

Inventors:

Yasutaka Nishi, Tokyo, JP;

Makoto Nakazumi, Yamato, JP;

Assignee:

NIKON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 13/02 (2006.01); B05B 7/08 (2006.01); B05B 13/04 (2006.01); B05B 16/60 (2018.01); B05B 17/06 (2006.01); B05D 1/02 (2006.01); B05D 3/06 (2006.01); C23C 24/08 (2006.01); G03F 7/16 (2006.01); H10K 71/00 (2023.01); H10K 71/60 (2023.01); B05D 3/10 (2006.01);
U.S. Cl.
CPC ...
H10K 71/00 (2023.02); B05B 7/0869 (2013.01); B05B 13/0221 (2013.01); B05B 13/0463 (2013.01); B05B 16/60 (2018.02); B05B 17/06 (2013.01); B05D 1/02 (2013.01); B05D 3/062 (2013.01); C23C 24/082 (2013.01); G03F 7/16 (2013.01); H10K 71/611 (2023.02); B05D 3/06 (2013.01); B05D 3/10 (2013.01); B05D 2252/02 (2013.01);
Abstract

A film forming apparatus, a substrate processing apparatus, and a device manufacturing method are provided, which improve the film thickness uniformity of a thin film that is formed on a substrate by spraying a thin film material. The film forming apparatus which forms a thin film on a substrate is provided with a nozzle that sprays a thin film material and an exhaust unit that discharges a gas. An exhaust port of the exhaust unit is arranged on a side that is opposite to the direction in which the gravity acts with respect to the substrate. The substrate processing apparatus performs a predetermined process on the substrate using the film forming apparatus. The device manufacturing method manufactures a device using the film forming apparatus.


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