The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jun. 25, 2019
Applicant:

Antpool Technologies Limited, Hong Kong, CN;

Inventor:

Hanlin Chen, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); H05K 7/20327 (2013.01); H05K 7/20409 (2013.01);
Abstract

Embodiments of the present disclosure relate to a cooling device, including a housing and a heat dissipation assembly. A sealed space for accommodating cooling liquid is formed in the housing. The cooling liquid is in contact with a to-be-cooled component. The heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body. The heat dissipation assembly body is arranged in the sealed space formed by the housing. The heat dissipation assembly body is configured to, after the cooling liquid transforms into the gas by absorbing the heat of the to-be-cooled component, absorb the heat of the gas to convert the gas into the liquid. The heat conducting pipe is at least partially located outside the housing. The heat dissipation assembly body is arranged at ½ to ¾ the position along the height direction in the housing.


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