The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Nov. 23, 2020
Applicant:

Socovar Societe En Commandite, Québec, CA;

Inventors:

François Blanchard, Montréal, CA;

Mariia Zhuldybina, Montréal, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/12 (2013.01); H05K 13/081 (2018.08); H05K 2203/163 (2013.01);
Abstract

There is described a method of assessing an ink deposition accuracy in an electronic device printing process. The method generally has: printing a meta material structure on a substrate using conductive ink, the metamaterial structure having a pattern of conductive elements interspersed with complementary insulating elements, the metamaterial structure having at least a terahertz resonance frequency; emitting a terahertz radiation beam incident on the metamaterial structure of the substrate, the incident terahertz radiation beam having power at least at the terahertz resonance frequency of the metamaterial structure; the metamaterial structure interacting with said incident terahertz radiation beam resulting in an outgoing terahertz radiation beam having a spectral response at least at the terahertz resonance frequency; measuring said spectral response of said outgoing terahertz radiation beam; assessing an ink deposition accuracy of said printing based on said measured spectral response; and generating a signal based on said assessed ink deposition accuracy.


Find Patent Forward Citations

Loading…