The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Nov. 01, 2021
Applicants:
Raytheon Company, Waltham, MA (US);
The University of Massachusetts, Lowell, MA (US);
Inventors:
Craig A. Armiento, Acton, MA (US);
Yuri Piro, Boston, MA (US);
Andrew M. Luce, Marlborough, MA (US);
Emily Lamport, Pelham, NH (US);
Oshadha Ranasingha, Salem, NH (US);
Christopher R. Areias, Lawrence, MA (US);
Christopher N. Kuncho, Attleboro, MA (US);
Alkim Akyurtlu, Arlington, MA (US);
Edward D. Kingsley, Stow, MA (US);
Assignees:
RAYTHEON COMPANY, Waltham, MA (US);
THE UNIVERSITY OF MASSACHUSETTS, Lowell, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); C09D 11/037 (2014.01); C09D 11/101 (2014.01); C09D 11/102 (2014.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); C09D 11/037 (2013.01); C09D 11/101 (2013.01); C09D 11/102 (2013.01); H05K 3/30 (2013.01); H05K 2201/0112 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/0209 (2013.01);
Abstract
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.