The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Feb. 22, 2022
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Gwanyong Lee, Gyeonggi-do, KR;

Cheol Hwang, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A camera module is provided and includes an image sensor and a printed circuit board (PCB) structure electrically coupled to the image sensor. The PCB structure may include a first layer disposed under the image sensor, a second layer disposed between the first layer and the image sensor, a first conductive pattern formed on the first layer and electrically coupled to the image sensor through one end portion of the first conductive pattern so as to transfer a signal obtained from the image sensor to an external electronic component, and a first open space formed in the second layer such that the one end portion of the first conductive pattern is exposed to a surface of the PCB structure.


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