The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Oct. 10, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Patrick Turner, San Bruno, CA (US);

Mike Eddy, Santa Barbara, CA (US);

Andrew Kay, Provo, UT (US);

Ventsislav Yantchev, Sofia, BG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/58 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 9/25 (2013.01); H03H 9/02228 (2013.01); H03H 9/02992 (2013.01); H03H 9/105 (2013.01); H03H 9/1085 (2013.01); H03H 9/586 (2013.01); H03H 9/6406 (2013.01);
Abstract

Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.


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