Radio frequency active antenna system in a package

Abstract

The wireless RF semiconductor system is described for use in wireless communication devices that operate in frequency range from 6 GHz to 100 GHz. The system comprises of at least one RF antenna and at least one active RF component fabricated (or built) on the same semiconductor substrate inside a one single packaged module. The wireless RF semiconductor system is described in a variety of different configurations with its functionality divided up over several single chip circuits. The system simplifies assembly, reduces size and cost, and allows for a quick time to market, while maximizing the RF performance demanded by fixed and mobile 4G, 5G and other wireless standards. The system uses a novel idea of design and packaging of active and passive RF components into a single package. This in turn allows RF designers to unlock the potential of very high frequencies operation that were previously thought too expensive and/or unattainable to average user. The wireless RF semiconductor system can be implemented in both mobile solutions (such as phones, tablets, and the like) and fixed applications (such as repeaters, base-stations, and distributed antenna system).