The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Dec. 13, 2022
Applicant:

Wistron Neweb Corporation, Hsinchu, TW;

Inventors:

Meng-Kai Wu, Hsinchu, TW;

Hong-Jun Jian, Hsinchu, TW;

Hsieh-Chih Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 3/18 (2006.01); H01Q 5/30 (2015.01); H01Q 9/04 (2006.01); H01Q 13/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2266 (2013.01); H01Q 1/48 (2013.01); H01Q 3/18 (2013.01); H01Q 5/30 (2015.01); H01Q 9/0457 (2013.01); H01Q 13/10 (2013.01);
Abstract

An electronic device and an antenna module are provided. The electronic device includes a metal housing and the antenna module disposed. The metal housing has a slot, and the slot has an open end. The antenna module includes a carrier, a feeding element, a radiating element connected to the feeding element, and a grounding element. The radiating element is disposed on a first surface of the carrier. An orthogonal projection of the radiating element that is projected onto the metal housing at least partially overlaps with the slot. The grounding element includes a first grounding portion and a second grounding portion electrically connected to each other. The radiating element and the first grounding portion are spaced apart from each other by a first coupling gap, and the radiating element and the second grounding portion are spaced apart from each other by a second coupling gap.


Find Patent Forward Citations

Loading…