The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

May. 14, 2020
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hiroya Yokoyama, Tokyo, JP;

Minoru Sakata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/298 (2021.01); C08L 71/12 (2006.01); H01M 50/50 (2021.01); H01M 50/588 (2021.01); H01M 50/591 (2021.01);
U.S. Cl.
CPC ...
H01M 50/298 (2021.01); C08L 71/12 (2013.01); H01M 50/50 (2021.01); H01M 50/588 (2021.01); H01M 50/591 (2021.01); C08L 2203/202 (2013.01);
Abstract

Provided is a wiring component having a covering material which is made to be resistant to damages or displacements even when a large amount of electricity is conducted. A wiring component of the present disclosure is a wiring component including an electrically conductive member having an extension length of 450 mm or more, and a covering member covering the electrically conductive member, wherein the covering member contains a polyphenylene ether resin composition, and has a secondary shrinkage A (%) in an extension length direction of the covering member after being subjected to thermal aging at 130° C. for 24 hours satisfying: A<12.5×e(in the expression, t represents a thickness (in mm)).


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