The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Apr. 12, 2019
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Ee Lian Lee, Balik Pulau, MY;

Boon Liang Yap, Penang, MY;

Prakash Rajah, Penang, MY;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/005 (2013.01); H01L 33/54 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.


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