The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Mar. 04, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Jia Liu, Yokohama, JP;

Masahiko Hori, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/48 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes: a substrate; a first MOSFET and a second MOSFET that are provided on a first surface of the substrate and have sources commonly coupled; a third MOSFET and a fourth. MOSFET that are provided on the first surface of the substrate and have sources commonly coupled; a light receiver that is provided on the first surface of the substrate and is coupled to the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET; and a light emitter that is provided on the light receiver.


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