The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Aug. 26, 2019
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/46 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 21/02304 (2013.01); H01L 23/10 (2013.01); H01L 23/3107 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 23/46 (2013.01); H01L 24/26 (2013.01); H01L 25/07 (2013.01); H01L 2924/181 (2013.01);
Abstract
Provided is a semiconductor device that prevents resin from leaking out from a resin insulating member at a periphery of the resin insulating member and thereby achieves an increase in reliability. The semiconductor device includes a module unit, a resin insulating member bonded to the module unit, a cooling unit coupled to the module unit with the resin insulating member interposed therebetween, and a flow blocking member disposed between the module unit and the cooling unit to surround the resin insulating member, the flow blocking member being more easily compressively deformable than the resin insulating member.