The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Oct. 10, 2019
Applicant:

Hitachi Energy Ltd, Zürich, CH;

Inventors:

Jagoda Dobrzynska, Lenzburg, CH;

Jan Vobecky, Lenzburg, CH;

David Guillon, Vorderthal, CH;

Tobias Wikstroem, Egliswil, CH;

Assignee:

Hitachi Energy Ltd, Zürich, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 21/56 (2006.01); H01L 23/051 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 21/565 (2013.01); H01L 23/10 (2013.01); H01L 23/3185 (2013.01);
Abstract

A power semiconductor device includes a semiconductor wafer having a junction and a junction termination laterally surrounding the junction. A protection layer covers the lateral side of the semiconductor wafer and covers the second main side at least in an area of the junction termination. A first metal disk is arranged on the first main side to cover the first main side of the semiconductor wafer. An interface between the first metal disk and the semiconductor wafer is a free floating interface. A metal layer sandwiched between the first metal disk and the semiconductor wafer.


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