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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12094740 B1

PDFFull Text
Date of Patent:
Sep. 17, 2024

Filed:

Mar. 25, 2021

Automated dry-in dry-out dual side polishing of silicon substrates with integrated spin rinse dry and metrology

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Manoj A. Gajendra, Bangalore, IN;

Mahadev Joshi, Bangalore, IN;

Joseph Antony Jonathan, Kalispell, MT (US);

Jamie S. Leighton, Palo Alto, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan, LLP

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 5/02 (2006.01); B08B 13/00 (2006.01); B24B 37/013 (2012.01); B24B 37/34 (2012.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); B08B 3/022 (2013.01); B08B 5/02 (2013.01); B08B 13/00 (2013.01); B24B 37/013 (2013.01); B24B 37/345 (2013.01); H01L 21/02057 (2013.01); H01L 21/30625 (2013.01); H01L 21/68707 (2013.01); H01L 22/12 (2013.01);
Abstract

A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. A spin rinse dry (SRD) station configured to clean and dry the substrates. A metrology station configured to measure parameters of the substrates. A robot configured to move the substrate in to and out of the SRD station. And an effector rinse and dry (EERD) station configured to clean and dry an end effector of the robot.

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