The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
May. 19, 2023
Applicant:
Elemental Scientific, Inc., Omaha, NE (US);
Inventors:
Tyler Yost, Omaha, NE (US);
Daniel R. Wiederin, Omaha, NE (US);
Beau A. Marth, La Vista, NE (US);
Jared Kaser, Fort Collins, CO (US);
Jonathan Hein, Elkhorn, NE (US);
Jae Seok Lee, Burford, GA (US);
Jae Min Kim, Gyeonggi-do, KR;
Stephen H. Sudyka, Omaha, NE (US);
Assignee:
Elemental Scientific, Inc., Omaha, NE (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01N 21/73 (2006.01); G01N 33/00 (2006.01); H01J 49/00 (2006.01); H01J 49/10 (2006.01); H01L 21/66 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6719 (2013.01); G01N 21/73 (2013.01); H01J 49/105 (2013.01); H01L 21/67051 (2013.01); H01L 21/6708 (2013.01); H01L 21/67126 (2013.01); H01L 21/6715 (2013.01); H01L 21/67259 (2013.01); H01L 21/67748 (2013.01); H01L 21/67772 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01); G01N 33/0095 (2024.05); H01J 49/00 (2013.01); H01L 22/12 (2013.01);
Abstract
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.