The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jan. 03, 2019
Applicant:

University of Maryland, College Park, College Park, MD (US);

Inventors:

Gary W. Rubloff, Clarksville, MD (US);

Sang Bok Lee, Clarksville, MD (US);

Keith Gregorczyk, Washington, DC (US);

Assignee:

University of Maryland, College Park, College Park, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/08 (2006.01); C23C 14/04 (2006.01); C23C 16/04 (2006.01); H01L 21/02 (2006.01); H01L 21/32 (2006.01); H01L 21/3205 (2006.01); H01L 49/02 (2006.01); H01M 4/04 (2006.01); H01M 6/40 (2006.01); H01L 31/0224 (2006.01); H01L 31/0445 (2014.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01); H10N 30/30 (2023.01); H10N 30/50 (2023.01);
U.S. Cl.
CPC ...
H01L 21/32 (2013.01); C23C 14/042 (2013.01); C23C 16/042 (2013.01); H01L 21/02636 (2013.01); H01L 21/3205 (2013.01); H01L 28/87 (2013.01); H01M 4/0423 (2013.01); H01M 4/0428 (2013.01); H01M 4/08 (2013.01); H01M 6/40 (2013.01); H01L 31/022425 (2013.01); H01L 31/0445 (2014.12); H01L 33/08 (2013.01); H01L 33/38 (2013.01); H10N 30/302 (2023.02); H10N 30/50 (2023.02);
Abstract

A solid-state device includes a substrate with a stack of constituent thin-film layers that define an arrangement of electrodes and intervening layers. The constituent layers can conform to or follow a non-planar surface of the substrate, thereby providing a 3-D non-planar geometry to the stack. Fabrication employs a common shadow mask moved between lateral positions offset from each other to sequentially form at least some of the layers in the stack, whereby layers with a similar function (e.g., anode, cathode, etc.) can be electrically connected together at respective edge regions. Wiring layers can be coupled to the edge regions for making electrical connection to the respective subset of layers, thereby simplifying the fabrication process. By appropriate selection and deposition of the constituent layers, the multi-layer device can be configured as an energy storage device, an electro-optic device, a sensing device, or any other solid-state device.


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