The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

May. 25, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Masashi Shimoyasu, Tokyo, JP;

Daiki Kato, Tokyo, JP;

Yoji Tozawa, Tokyo, JP;

Takashi Endo, Tokyo, JP;

Seiichi Nakagawa, Tokyo, JP;

Mitsuru Ito, Yurihonjo, JP;

Kenta Sasaki, Yurihonjo, JP;

Akihiko Oide, Tokyo, JP;

Makoto Yoshino, Tokyo, JP;

Kazuhiro Ebina, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 27/2804 (2013.01); H01F 41/043 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.


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