The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Mar. 03, 2023
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Brian P. Hohl, Clarence, NY (US);

Dallas J. Rensel, Sanborn, NY (US);

Jonathan Calamel, Clarence, NY (US);

Christine A. Frysz, Orchard Park, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B28B 1/00 (2006.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01); C04B 35/626 (2006.01); C04B 35/64 (2006.01); G06F 30/10 (2020.01); H01B 17/30 (2006.01); H01B 17/58 (2006.01); H01B 19/00 (2006.01); G06F 113/10 (2020.01);
U.S. Cl.
CPC ...
H01B 17/301 (2013.01); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); C04B 35/6269 (2013.01); C04B 35/64 (2013.01); G06F 30/10 (2020.01); H01B 17/58 (2013.01); H01B 19/00 (2013.01); C04B 2235/6026 (2013.01); G06F 2113/10 (2020.01);
Abstract

A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.


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