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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12094624 B1

PDFFull Text
Date of Patent:
Sep. 17, 2024

Filed:

Oct. 18, 2023

Lamination structure of second generation high-temperature superconducting (2g-hts) tape and method for fabricating the same

Applicant:

Supermag Technology (Shanghai) Ltd., Shanghai, CN;

Inventors:

Yue Zhao, Shanghai, CN;

Chunjiang Guo, Shanghai, CN;

Yue Wu, Shanghai, CN;

Wei Wu, Shanghai, CN;

Assignee:

SuperMag Technology (Shanghai) Ltd., Shanghai, CN;

Attorney:
Primary Examiner:

Pete T Lee

Int. Cl.
CPC ...
H01B 12/00 (2006.01); B23K 1/08 (2006.01); B23K 1/20 (2006.01); H01B 12/02 (2006.01); H10N 60/85 (2023.01); B23K 101/34 (2006.01); B23K 101/38 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
H01B 12/02 (2013.01); B23K 1/08 (2013.01); B23K 1/20 (2013.01); H10N 60/85 (2023.02); B23K 2101/35 (2018.08); B23K 2101/38 (2018.08); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08);
Abstract

A method for fabricating a lamination structure of a second-generation high-temperature superconducting (2G-HTS) tape is provided. Suitable lamination tapes are selected and subjected to local oxidation on side to form a locally oxidized region having a target pattern. The lamination tapes and a to-be-laminated 2G-HTS tape are sequentially arranged, where the locally-oxidized side of each of the lamination tapes faces toward the 2G-HTS tape. The lamination tapes and the to-be-laminated 2G-HTS tape are simultaneously immersed in a molten solder pool, and subjected to reel-to-reel squeezing lamination to form the desired lamination structure. A lamination structure fabricated by the method is also provided.

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