The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Feb. 10, 2021
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Hyakka Nakada, Tokyo, JP;

Takeshi Ohmori, Tokyo, JP;

Naoto Takano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/60 (2017.01); G06T 7/00 (2017.01); G06T 7/13 (2017.01); G06T 17/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/60 (2013.01); G06T 7/001 (2013.01); G06T 7/13 (2017.01); G06T 17/00 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30148 (2013.01);
Abstract

High-accuracy dimension extraction for a complicated shape possibly appearing through semiconductor processing. A starting point and an endpoint are placed on the periphery of a graphic shape including a combination of multiple ellipses, and a curve unicursally drawn on the periphery between the two points is used as a shape mode, thereby describing a contour of an intended structure.


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Nakada, Hyakka. (2024). Contour analysis apparatus, processing condition determination system, shape estimation system, semiconductor device manufacturing system, search apparatus, and data structure used in them (U.S. Patent No. 12094146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12094146

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