The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Apr. 30, 2021
Applicants:

Beijing Zhongxiangying Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Haijin Wang, Beijing, CN;

Chuan Wang, Beijing, CN;

Tian Lan, Beijing, CN;

Jianmin Wu, Beijing, CN;

Yu Feng, Beijing, CN;

Hong Wang, Beijing, CN;

Yu Wang, Beijing, CN;

Fan Zhang, Beijing, CN;

Jiawei Ren, Beijing, CN;

Jing Xue, Beijing, CN;

Jianfeng Zeng, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01);
U.S. Cl.
CPC ...
G01N 21/95 (2013.01); G01N 2021/9511 (2013.01);
Abstract

The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer. According to this, for the defect information on the current film layer, only the defect information caused by factors of the current film layer may be retained, and the defect information caused by the historical film layers will not be retained, and thus, on the one hand, the stored data volume may be reduced, and on the other hand, the complexity of subsequent analysis of defect information may be simplified.


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