The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Oct. 11, 2021
Applicant:

Memsensing Microsystems (Suzhou, China) Co. Ltd., Suzhou, CN;

Inventors:

Gang Li, Suzhou, CN;

Jiaxin Mei, Suzhou, CN;

Chenglong Shao, Suzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 13/06 (2006.01); G01L 19/06 (2006.01);
U.S. Cl.
CPC ...
G01L 13/06 (2013.01); G01L 19/0654 (2013.01);
Abstract

A package structure for a differential pressure sensor, and an electronic device are provided. The package structure includes: a substrate and a housing, an edge of the housing is fixed to a front side of the substrate and defines a first chamber with the substrate; and a pressure sensing element fixed to the front side of the substrate and disposed in the first chamber, the pressure sensing element is provided with a second chamber and a pressure sensing layer, the pressure sensing layer being disposed between the first chamber and the second chamber. The first chamber is connected with the outside via a first through hole, and the second chamber is connected with the outside via a second through hole.


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