The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2024
Filed:
Nov. 20, 2019
Sumitomo Precision Products Co., Ltd., Amagasaki, JP;
Suguru Takahashi, Amagasaki, JP;
Yasuhiro Fujita, Amagasaki, JP;
Sumitomo Precision Products Co., Ltd, Amagasaki, JP;
Abstract
An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger () includes a core () in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks () each of which is configured to include a plurality of flow path layers () and a partition wall layer () that divides the plurality of flow path blocks. A thickness (t) of the partition wall layer in a stacking direction is larger than an interval (t) between flow paths arranged in the stacking direction.