The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12091729 B1

Date of Patent:

Sep. 17, 2024

Filed:

Feb. 27, 2019

Method of producing a vehicle glass assembly

Applicant:

Acr Ii Glass America Inc., Nashville, TN (US);

Inventor:

Olivier Farreyrol, Machtum, LU;

Assignee:

ACR II GLASS AMERICA INC., Nashville, TN (US);

Attorney:

K&L Gates LLP

Primary Examiner:

Kiley S Stoner

Int. Cl.

CPC ...

B23K 1/00 (2006.01); B22F 1/06 (2022.01); B23K 3/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C03C 27/04 (2006.01); C22C 13/00 (2006.01); H01Q 1/12 (2006.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01); H05B 3/84 (2006.01); B23K 101/00 (2006.01); B23K 103/00 (2006.01);

U.S. Cl.

CPC ...

C22C 13/00 (2013.01); B22F 1/06 (2022.01); B23K 1/00 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 3/02 (2013.01); B23K 35/262 (2013.01); B23K 35/3006 (2013.01); B23K 35/302 (2013.01); C03C 27/04 (2013.01); H01Q 1/1278 (2013.01); H01R 4/024 (2013.01); H01R 43/02 (2013.01); H05B 3/84 (2013.01); B23K 1/0004 (2013.01); B23K 2101/006 (2018.08); B23K 2103/54 (2018.08); H01R 2201/02 (2013.01); H05B 2203/01 (2013.01);

Abstract

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

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