The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2024

Filed:

Jul. 14, 2023
Applicant:

Sun Chemical Corporation, Parsippany, NJ (US);

Inventors:

Tun-Jen Hsiao, St. Charles, IL (US);

Erika Rebrosova, St. Charles, IL (US);

Korey Stellmach, St. Charles, IL (US);

Assignee:

Sun Chemical Corporation, Parsippany, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/101 (2014.01); B41M 7/00 (2006.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); C09D 11/52 (2014.01);
U.S. Cl.
CPC ...
C09D 11/101 (2013.01); B41M 7/0081 (2013.01); C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 11/52 (2013.01);
Abstract

UV curable inks comprising a polycarbonate resin; acrylated polymers or oligomers having an aromatic or aliphatic polycarbonate backbone, one or more photoinitiators; and one or more adhesion promoters, are provided, which inks can be formulated as conductive inks or dielectric inks. The UV-curable inks are useful in preparing printed electronic and injection-molded structural electronic components and devices. The UV-curable inks exhibit high elongation and thermoformability, and are especially well suited for use in injection molding processes for printed electronics and thermoformed printed electronic applications.


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